Business field
Business field

Failure Analysis



Main Business Support

  • Semiconductor Failure Analysis (Semiconductor Analysis)

    Delamination, Voids, Package crack, Die crack, White bump, Pattern Short, De-wetting, Via Hole, Migration Analysis,
    Whisker Analysis etc.

  • Material Failure Analysis

    Metallic compound, Solder crack, Solder Defect, Pattern, Via Hole, Cross-section, De-wetting, Lift-off, Component analysis,
    Grain analysis, Material Analysis etc.

  • PCB Component Failure Analysis (PCB Analysis)

    Bond test, Push-Pull test, Fracture test etc.

  • Solderability Analysis (Solderability Analysis)

    Component Analysis, Pattern/BGA Short, Voids Area Analysis etc.

01 Business Support: Test Fields and Applied Standards

Test Field Application Specifications
Shape Analysis - Microstructure and Structural Analysis of Materials Using Microscopic Equipment
- 2D/3D defective analysis using X-ray
- Sample pre-treatment and cross-sectional analysis for junction assessment
Physical Analysis Evaluation of mechanical properties of Push/Pull/Shear, component analysis of organic/inorganic materials
Ultrasound analysis Delamination analysis of surface and internal defects of materials
Hyper-accelerated stress test Provides reliability evaluation in a short time by accelerating test conditions
Test Field Applicable specification
Hyundai/Kia Motors [ES] ES90000-01, 02, 03, 04, 05, 06, ES39220-06, ES91101-00, ES95400-10, ES97110-03,
ES91500-00, 02, 03, ES95910-93 etc.
Ssangyong Motors [SES] SES-E 011-04, SES-E 950, SES-E 060-07, etc.
GMW GMW3172, GMW3286, GMW14872, GMW3431, GMW14834 etc.
Ultra-accelerated stress tests BMW (GS), Peugeot (PSA), Volkswagen (VW), Toyota (TSC), Nissan (NDS, NES), etc.

02 Main Test Equipment

  • 3D Digital Optical Microscope
    (Optical Microscope)
  • SEM-EDS Electron Microscope
    (Scanning Electron Microscope)
    (Energy Dispersive Spectrometer)
  • Ultrasonic SAT
    (Scanning Acoustic Microscope)
  • Bonding Strength Tester
    (Bond tester)
  • 3D X-ray/CT