Failure Analysis

Main Business Support
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									- Semiconductor Failure Analysis (Semiconductor Analysis)
- 
											Delamination, Voids, Package crack, Die crack, White bump, Pattern Short, De-wetting, Via Hole, Migration Analysis, 
 Whisker Analysis etc.
 
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									- Material Failure Analysis
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											Metallic compound, Solder crack, Solder Defect, Pattern, Via Hole, Cross-section, De-wetting, Lift-off, Component analysis, 
 Grain analysis, Material Analysis etc.
 
- 
									- PCB Component Failure Analysis (PCB Analysis)
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											Bond test, Push-Pull test, Fracture test etc. 
 
- 
									- Solderability Analysis (Solderability Analysis)
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											Component Analysis, Pattern/BGA Short, Voids Area Analysis etc. 
 
01 Business Support: Test Fields and Applied Standards
| Test Field | Application Specifications | 
|---|---|
| Shape Analysis | - Microstructure and Structural Analysis of Materials Using Microscopic Equipment - 2D/3D defective analysis using X-ray - Sample pre-treatment and cross-sectional analysis for junction assessment | 
| Physical Analysis | Evaluation of mechanical properties of Push/Pull/Shear, component analysis of organic/inorganic materials | 
| Ultrasound analysis | Delamination analysis of surface and internal defects of materials | 
| Hyper-accelerated stress test | Provides reliability evaluation in a short time by accelerating test conditions | 
| Test Field | Applicable specification | 
|---|---|
| Hyundai/Kia Motors [ES] | ES90000-01, 02, 03, 04, 05, 06, ES39220-06, ES91101-00, ES95400-10, ES97110-03, ES91500-00, 02, 03, ES95910-93 etc. | 
| Ssangyong Motors [SES] | SES-E 011-04, SES-E 950, SES-E 060-07, etc. | 
| GMW | GMW3172, GMW3286, GMW14872, GMW3431, GMW14834 etc. | 
| Ultra-accelerated stress tests | BMW (GS), Peugeot (PSA), Volkswagen (VW), Toyota (TSC), Nissan (NDS, NES), etc. | 
02 Main Test Equipment
- 
									  - 3D Digital Optical Microscope
- (Optical Microscope)
 
- 
									  - SEM-EDS Electron Microscope
- (Scanning Electron Microscope) 
 (Energy Dispersive Spectrometer)
 
- 
									  - Ultrasonic SAT
- (Scanning Acoustic Microscope)
 
- 
									  - Bonding Strength Tester
- (Bond tester)
 
- 
									  - 3D X-ray/CT
 














